散热

拓扑优化方法在连续体结构、MEMS机构和散热结构等结构优化设计方面得到了广泛应用。

Topology optimization has been widely used in continuum structures , MEMS and heat radiation structures design .

指出：自锁式V型联结，砧模与基座间始终保持紧密接触，具有自锁作用，故模的导电性及散热性良好，使用寿命明显提高，可取得较好的经济效益。

Among them the " V " type joining can get the contact close-connected with auto-lock effect , which results in good conductibility and heat radiation of anvil , greatly improving the life of utensil system .

他摇下窗子来散热。

He wound down the windows to dissipate the heat .

我们的身体能出汗，由此可以蒸发散热。

Our bodies can sweat , thereby losing heat by evaporation

婴儿散热比成年人快得多，在出生后的头一个月特别容易感冒。

Babies lose heat much faster than adults , and are especially vulnerable to the cold in their first month .

你应装双层玻璃以免散热。

You should ensure against loss of heat by having double glazing .

备注：进气管为钢管设计，耐用、散热快

Note Inner Tube material is copper , radiates quickly and durably .

大功率LED灯具散热系统的设计和研究

The Study and Design of LED Thermal System

该封装结构无论是应用于单芯片还是多芯片阵列封装，都可以满足LED的散热要求。

The packaging both for single-chip and multi-chips could meet the heat-release requirement for high-power LEDs .

目前，散热问题和出光效率低限制大功率LED的发展。

Currently , the radiating problem and the low light efficiency limit the development of high-power LED .

GaN基功率型LED芯片散热性能测试与分析

Thermal Dispersion of GaN - base d Power LEDs

采暖散热器装饰罩对室内散热影响的CFD分析

CFD Analysis of Influences of Radiator 's Decorative Cover on Indoor Heat Emission

目前，制约LED照明系统推广应用的关键因素之一是散热。

At present , removal of heat is one of the key factors that restrict the large-scale applications of tunnel LED illumination .

研究人员往往通过改变热沉材料、改进封装结构和散热结构等方式来解决大功率LED的散热问题。

Usually , the heat of large power LED is eliminated by changing heat sink materials , improving packaging and heat dissipation structures .

逆变焊机中IGBT散热及过热保护技术的研究

Research on the Techniques for IGBT Radiating and Overheat Protection of Inverter Welder

针对高功率二极管激光器（DL）的散热需求，对不同结构的微通道冷却器进行了模拟散热计算，优化了冷却器的结构参数。

Structural parameter of micro-channel heatsink is optimized through numerical calculation .

设计了IGBT器件驱动电路、缓冲电路和散热装置。

The driver circuit , buffer circuit and cooling equipment of IGBT device are designed .

TBM施工中的通风和散热问题研究

Study on Ventilation and Heat Elimination in TBM Construction

将压电陶瓷泵应用于国内液冷散热器的研究，进一步扩大了国内CPU液冷散热问题的研究领域。

It makes piezoelectric ceramic pump really apply to domestic liquid-cooling radiator research , extending the fields of the domestic CPU liquid-cooling system .

在加速器驱动的次临界核能系统（简称ADS）的研究中，中子散裂靶的散热是一个重要的课题。

For the study of Accelerator Driven sub critical System ( ADS ), the heat transfer of spallation neutron target is an important issue .

然而，此PCM调温服却在很大程度上增加了服装湿阻，降低了汗液蒸发散热。

This type of PCM clothing , however , increased clothing evaporative resistance to a large extent and deteriorate evaporative cooling .

SCSI设备安装在机箱内，由机箱对其提供电源，散热和保护等功能。

SCSI devices reside in enclosures can provide power , cooling , and protection for the devices as well .

我认为它还有一点不足是因为在使用Apple的大量创新不兼容组件时还有一些困难，例如声卡和散热管理系统。

I think it gets a bad rap because of the difficulty in keeping up with Apple 's vast array of innovatively incompatible components , such as sound cards and thermal management systems .

本文运用APDL（AnsysParameterDesignLanguage）语言，在ANSYS开发环境中对平板式散热片进行结构优化设计，并给出实例验证本文提出的方法。

A method of designing and optimizing the plate-fin heat sinks using ANSYS parameter Design Language ( APDL ) was intro-duced in this paper , and an example was given to verify this method .

SF6是一种无色、无嗅、无毒、不易燃的惰性气体，具有良好的绝缘性、灭弧性和散热性。

SF6 is a colorless , odorless , nontoxic , and nonflammable inert gas with excellent electric insulating and arc-quenching properties .

风冷柴油机散热片Nusselt数的数学模型研究

A mathematic model study on Nusselt number of fins of a high speed aircooled diesel engine

然而随着发光二极管功率的不断增大，热流密度也不断增大，散热问题已经成为制约其发展和应用的瓶颈，因此必须不断改善LED器件及应用过程的热设计。

However , with the increase of power and heat flux , high die temperature has become the main bottleneck for its further application . Consequently , thermal design should be indispensable in design and application of LED .

以此为基础，利用合理的散热设计和过热保护电路，设计并实现了一套UHF宽带固态大功率放大器。

On this basis , by using logical cooling means and superheat protect means , we design and implement a UHF broadband solid-state high power amplifier .

鉴于PIN开关有承受更大的射频功率倾向和梁式引线PIN二极管散热较差的事实，本文提出了一种替代法进行功率验证。

Being the fact that PIN switch tends to handle higher power and beam lead PIN diode has bad thermo diffuse properties , a power substitution method is proposed to verify PIN switch designs .

通过分析当前主动型CPU散热器存在的问题，提出利用热管技术解决CPU散热问题的新方案。

According to watching the problems of the active type CPU 's radiator , I suggest a new project using heat pipe technology to solve the problems of CPU 's thermal dissipation . thermal dissipation .