fcbga

Application notes about the assembly of FCBGA device is introduced .

介绍FCBGA器件PCB组装应用时需要考虑的若干要点。

This paper describes the concept , characteristic and process of Multi-layer Thin-Substrate ( MLTS ) package technology , and developed high performance FCBGA and CSP using MLTS package technology .

概述了超高密度薄型基板（MLTS）封装技术的概念、特征和工艺以及应用MLTS封装技术开发的高性能FCBGA和CSP。