solder

Application of Computer Graphic Technology in Measurement of Tin Solder Spreading Area

电脑图形处理技术在锡焊料铺展面积测量中的应用

In addition , electricity resistance of the solder also has been measured .

除此之外，还对焊料进行了电阻测量。

Fewer workers are needed to solder circuit boards

焊接电路板需要的工人更少了。

He cuts the pieces and solders them together .

他把那些断片切碎，然后把它们焊在一起。

He then soldered the wire to the telephone terminal

接着他把电话线焊接到电话机上。

The stainless tubing is less likely to kink than copper , but it is harder to solder without an acid treatment .

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

Care must be exercised in attaching the lead wires to the soldering tabs .

在往接线片上焊导线时必须非常小心

I suggest posing me with a soldering wand over my head like a sword .

我想让自己这样像把剑一样把电焊杆举过头顶

Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

Research and development trend of lead-free solder alloy at home and abroad

无铅软钎料国内外的研究动态与发展趋势

The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

Development of a High Performance Lead-Free Wave Solder Alloy

开发高性能的无铅波峰焊料合金

The Research Progress on Soldering Materials for Electronics Industry

电子软钎焊材料的研究进展

Present Situation and Green Design of Wave Soldering

波峰焊接技术现状及绿色化设计方向

It is important to tailor cooling rate to improve solder joint quality .

选择合适的冷却速率可以提高焊点质量。

Study on Soldering Process for Rotor End Ring of Special Canned Motor

特种屏蔽电机转子端环钎焊工艺的研究

Electrical communication engineering ; soldering distributors , requirements and test conditions .

电讯技术。焊片端子板。要求和检验。

Analysis of solder joint position , check multilayer welding .

分析焊点位置，检查多层板焊接。

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

Use plenty of soldering flux to ensure a perfect connection .

使用大量的焊接通量，以确保完美的连接。

Probe into the Soldering Methods for Cast Iron Part

铸铁零件焊补方法的探讨

Electric induction soldering process of finned tube and its application

翅片管电感应钎焊工艺及其应用

Reliability Evaluation and Analysis Technology of Pb-free Solder Mounting Components

无铅焊料安装元件的可靠性评价和解析技术

High performance electronic lead free solder CWB & 07 series were developed .

研制了一种具有自主知识产权的高性能无铅电子钎料CWB&07系列。

Preparation and Study on Active Substance of Soldering Flux

助焊剂活性物质的制备与研究

Finite Element Analysis for Flip Chip Solder Joint Reliability

倒装芯片焊点可靠性的有限元模拟法探讨

Study On The Application of Solder Used in Gold-plated PCB

镀金层电子线路用特种焊料应用研究

Defect Analysis and Process Improvement of BGA Solder Joint

BGA焊点的缺陷分析与工艺改进

Optimization Design with CAE for Precision Injection Mould for Solder Wire Plates

精密焊丝盘注塑模具的CAE优化设计

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球栅阵列倒装焊封装中的热应变值的测试