vias

Results show that the optimal design parameters and the added ground vias improve the signal integrity .

测试结果表明，设计参数的优化和添加接地过孔能有效提高信号的完整性。

Effects of PCB Vias on High-Speed Signal Transmission

PCB中过孔对高速信号传输的影响

Modeling and Analysis of Vertical Vias in High Speed Printed Circuit Board

高速印刷电路板间垂直通孔的建模与分析

Full Wave Characterization Analysis of Entire Vias in High Speed Printed Circuit Board

高速印刷电路板间完整通孔的全波特性分析

Cracking Analysis on Blind Vias of PCB for Novel Mobile Phones

新型手机用印制电路板盲孔的开裂分析

Brand image is enhanced by product , and VIas a supplement .

设计识别是通过产品强化统一的品牌形象，并以视觉形象作为补充。

The Thickness Control of Heavy Copper Multilayer PCB with Blind and Buried Vias

浅谈多层埋/盲孔厚铜板的厚度控制

The Technology of Tin Plating In Micro Blind Vias

浅谈微盲孔电镀锡工艺控制

Plating High Aspect Ratio Blind Vias

高厚径比盲孔电镀

Improved landing pad for laser micro vias .

增强了激光微导孔着陆架。

After discussing the theoretical method , the vias and the differential vias have been modeled and the simulation results have been analyzed .

在提出理论方法的基础上，对多种过孔和差分过孔进行建模和参数优化，并对仿真结果进行了频域和时域上的分析。

The vias are discontinuous connections , which will induce more serious signal integrity problems and electromagnetic interference ( EMI ) .

而含有通孔不连续结构的互连线在高速电路中将会带来更严重的信号完整性问题与电磁干扰（EMI）。

This paper describes the outline and the method of the thickness control for heavy copper multilayer PCB with blind and buffed vias .

简要概述了带有埋/盲孔厚铜箔多层印制板制作过程中的厚度控制要点和方法。

This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors , metal lines and vias for interconnection .

本研究重点研究了MCM&C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。

Research on Measuring Welding Residual Stress of Plate of Moderate Thickness Using Blind-hole Method ; Cracking Analysis on Blind Vias of PCB for Novel Mobile Phones

中厚板焊接残余应力测试的盲孔法研究新型手机用印制电路板盲孔的开裂分析

With introducing via modulation factor , the cooling of vias is contained and introducing equivalent thermal conductivity , the effect of adjacent wires is included .

通过引入通孔调制因子归纳了通孔散热的作用，通过引入等效热传导系数包含了相邻导线热耦合的影响，简化了温度的求解。

A fast algorithm , based on the cavity-mode model , was employed for estimating the impedance of multilayer power bus stacks interconnected by vias .

应用作者发展的基于全腔模模型的快速算法，本文研究过孔互连多层供电系构造的阻抗特性。

Experimental results show that the numbers of vias can be reduced greatly and , for some examples , the numbers of tracks are also less than those of known results .

结果表明，该算法不仅使通孔数大大减少，而且有些例子的走线道数也较一般布线法少。

Themal reliefs are sometimes also used on vias very near , or in , pads of SMT components for the same reason .

基于同样的原因，限热槽也用于贴片元件内或离元件很近的焊盘。

In this algorithm , vias can occur between any layers , and could not cross with the other nets at any layers . His face was a perfect study .

算法允许通孔打在任意两层之间，并使得通孔不在它所穿过的层上与其它线网相交。他的面孔真有意思。

A three dimensional ( 3D ) LTCC microwave transmission structure was studied in this paper , and stacked vias were applied in the structure to realize vertical microwave interconnecting .

本文研究采用了一种三维LTCC微波传输结构，并采用叠层通孔实现垂直微波互连。

Driven by the high-performance computing and the miniaturization of electronic devices , Through Silicon Vias ( TSV ) 3D packing technology becomes a key technology in chip interconnect .

受高性能计算和电子器件小型化的驱动，硅通孔（ThroughSiliconVias，TSV）工艺成为3D封装中芯片垂直互连的关键技术。

For simultaneous switching noise ( SSN ) problems in high speed integrated circuits , typical models of power / ground structures are extracted with through-hole vias being taken into account .

针对高速电路中的同步开关噪声（SSN）问题，提取出具有via和通孔结构的典型电源/地板模型。

Then , we propose a genetic algorithm based method , which is used to explore the optimal removal of some redundant vias to get a conflict-free bipartite graph for double via insertion .

最后，提出一种通过遗传算法来优化冗余孔的移除的方法，从而得到一个没有冲突的二分图，通过最大二分匹配算法来实现双通孔的插入。

The transmission paths include transmission lines and through hole vias on high-frequency circuit boards . This paper will focus on the following two problems including transmission line effect and the distributed parameter effect of vias .

传输路径主要包括传输线和过孔，因此传输线效应和过孔的分布参数效应将是重点研究的两个问题。

In the proposed method , an undirected graph is used to represent candidate relationships between vias and redundant vias , and conflict relationships between redundant vias due to design rule violations .

首先建立一个用于表示通孔和冗余通孔之间的候选关系的无向图，这个无向图也能用于表示违反了设计规则的冗余孔之间的冲突关系。

During the multi-stage evolution of mantle plume , especially the ore-forming materials found their way into the crust vias the mantle , it is inevitable that some crustal material would have been involved .

在地幔热柱多级演化过程中，特别是在通过地幔进入地壳后，不可避免地会融入部分壳源物质，这就使得所测数据往往介于典型幔源区与壳源区之间。

In further , it is found the reflection phase band-gap is independent on the central vias of AMC structure . And so , a simpler strip type AMC structure is brought forward based on rectangular structure .

进一步研究发现AMC结构单元的中心位置的过孔的存在与否并不影响其反射相位带隙，故在对矩形AMC结构的基础上提出了一种结构更为简单的一维条带型AMC结构。

It is described the technology of plating high aspect blind vias in this paper , especially of plating blind vias which sizes of 4 mils and above , utilizing different laser drilling , metallization and plating .

介绍了有关高厚径比盲孔电镀的有关工艺，从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。

The information which is stored in ROM is the ROM Code . Existing solutions of ROM Code are diffusion layer and vias / contacts , for high density and low power applications , but its flexibility is relatively low .

ROMCODE是ROM所要存储的信息内容，现有的ROMCODE的解决方案包括扩散层和过孔/接触可编程ROM，适用于高密度和低能耗应用，但它的灵活性比较低。