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wafer

美 [ˈweɪfər]英 [ˈweɪfə(r)]
  • n.薄片;晶体;圣饼;威化饼,薄脆饼(常与冰激凌同吃);面饼;圣体

复数: wafers

waferwafer

noun

1

威化饼,薄脆饼(常与冰激凌同吃)
a thin crisp light biscuit/cookie, often eaten with ice cream

2

圣饼;圣体;面饼
a very thin round piece of special bread given by the priest during Communion

3

薄片
a very thin piece of sth

wafer

频次

  • 1
    N-COUNT 威化饼,薄脆饼(常与冰激凌同吃)
    A wafer is a thin crisp biscuit which is usually eaten with ice cream.

  • 2
    N-COUNT (基督教圣餐仪式上牧师发放的)圣饼
    A wafer is a circular, thin piece of special bread which the priest gives people to eat in the Christian service of Holy Communion.

noun

1
thin disk of unleavened bread used in a religious service (especially in the celebration of the Eucharist)
2
a small thin crisp cake or cookie
3
a small adhesive disk of paste;used to seal letters

数据来源:WordNet

  1. Would you like to know who ate the wafer ?

    你想知道谁吃了威化饼么?

  2. Automatic Water Baking Machine : a wafer production equipment with electric power or LPG to generate the heat energy for automatic completion of mixture and baking process .

    隧道式烤炉:是生产威化饼设备、下浆、烘烤、出饼片全自动完成,热能采用电或液化气。

  3. Remove the wafers with a spoon and transfer them to a plate

    用勺子抄起薄饼,把它们转盛到盘子里。

  4. All organic and metallic residues on the wafers must be removed .

    片子上所有的有机和金属残留物均必须清除

  5. Research and Design of Measuring and Sorting Quartz Crystal Wafer System

    石英晶片测量分选系统的研究与设计

  6. Piezoelectric Wafer Model and its Application in Structural Health Monitoring

    压电晶体传感器激励模型及其在结构健康监测中的应用

  7. Study on the New Method of CD Calibrating for IC Wafer

    IC晶片关键尺寸标定的新方法研究

  8. A Silicon Wafer Direct Bonding Mechanism and Rapid Thermal Bonding Technology

    硅片直接键合机理及快速热键合工艺

  9. Developmental trend for processing technology of 300 mm wafer chip manufacturing

    300mm晶圆芯片制造技术的发展趋势

  10. Two main wafer slicing methods are used currently .

    目前,晶片切割主要的方法有金刚石内圆切割和线切割。

  11. Decomposition Based Ant Colony Optimization Algorithm Applied to Semiconductor Wafer Fabrication System

    基于问题分解的蚁群算法在半导体晶圆制造调度中的应用

  12. Protection of wafer resources moving towards river basin model

    水资源保护走向流域模式

  13. Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer

    硅晶片化学机械抛光中的化学作用机理

  14. Research on Swarm Intelligence Based Scheduling Model for Semiconductor Wafer Fab

    半导体生产线群体智能调度模型研究

  15. Design of vacuum clamp system used for Si wafer

    硅片真空夹紧系统设计

  16. Effects of The Silicon Wafer Direct Bonding Interface on Device Performances

    硅片直接键合界面的存在对器件性能的影响

  17. New Method of Quality Controlling of LED Epi - Wafers

    发光二极管外延片质量控制的新方法

  18. Development of Core Wafer Core Materials for Use as Dual Sound Track Magnetic Head

    双声道磁头用芯片材料的研制

  19. The Analysis and Research About Silicon Wafer ′ s Polishing Fog

    硅片抛光雾的分析研究

  20. Study on quality improvement of silicon wafers annealed at high temperature in hydrogen

    高温氢气退火提高硅片质量的研究

  21. Methods of optimization for throughput and cycle time in semiconductor wafer fabrication

    半导体晶圆制造中产量与生产周期的优化方法

  22. The Edge Effect of SAW Wafer in Probe On-line Testing

    SAW器件晶片在线探测中的边缘效应

  23. Shape Bifurcation of an Elastic Wafer Due to Surface Stress

    表面应力引起的弹性薄膜形状分叉

  24. Research on special controlling technology of ultra-precision polishing machine for IC wafer

    IC硅片纳米级抛光机专家控制技术的研究

  25. In this paper , the key technologies of silicon wafer grinding equipment are analyzed .

    本文分析了硅片超精密磨削设备的关键技术;

  26. Research and design of the quartz wafer thickness gauge

    石英晶片厚度检测仪研究设计

  27. Semiconductor chip testing is very important for wafer fabrication .

    半导体芯片的检测是芯片生产企业生产过程中的重要环节,芯片在检测过程中,由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。

  28. Hundred times of cleaning and drying process is applied during wafers manufacturing .

    在集成电路的生产制造过程中,晶圆的清洗和干燥工艺是使用最频繁、重复次数最多的工艺过程。

  29. Research Advances in Wafer Bonding Technique of GaN Material

    GaN材料键合技术研究进展

  30. Study on the Deposition of Copper onto Silicon Wafer Surface in HF Solution

    HF溶液中铜离子在硅片表面沉积的研究