or DRAM ( computer memory chips ) . " XMC , however , is developing today 's leading-edge 3D NAND chips to be test-ready by the end of this year , said Hui He , a senior analyst for China 's semiconductor market at IHS Technology .
不过，IHS公司半导体行业的资深分析师何慧却表示，目前武汉新芯已经在研制高水平3DNAND闪存芯片，即将在今年年末投入测试。
xmc