无源元件

美国埋入无源元件PCB材料的现状

Current Status of Embedded Passive Printed Circuit Board Materials in United States

在RF电路中嵌入无源元件

Embedding Passive Components in RF Circuit

与同类电路〔6〕比较，该电路结构简单，RC元件少，除一个RC元件浮置外，其余无源元件均接地，因此更便于集成。

Compared with similar circuits , the filter has a simpler structure and fewer elements .

本电路由1个CCⅡ和4个无源元件综合而成。

The sample circuit is integrated with a single CC ⅱ and four passive elements .

该结构电路形式对称，通过外接无源元件RC之取值，可实现任意滤波特性。

The arbitrary filter characteristics can be realize in this structure by setting the value of passive elements connected outside .

介绍了RFSOICMOS技术的特点。着重论述了RFSOICMOS技术的低串扰特性、低损耗特性及其优质无源元件的性能。

Features of RF SOI CMOS technology are presented with emphasis on its low cross-talk characteristics and passive element performances .

由于手机射频前端部分含有大量无源元件，FEM成为利用LTCC的典型器件。

The RF part of mobile phone has a lot of passive devices , so FEM becomes of a typical LTCC device .

所提电路结构简单、中心频率ω0和品质因数Q独立可调、无源元件全部接地，滤波器特性参数对无源元件灵敏度低。

The proposed circuits are with simple structure , seperately adjustable centre frequency ω 0 and the quality factor Q , all grounded passive components and low passive sensitivities .

提出仅用一个CCⅡ和7个无源元件实现高通、低通、带通和带阻的新电路。

It is proved that a new active filter can fulfil highpass , lowpass , brand - pass and band - stop by CC ⅱ and seven passive elements .

采用高位电荷定标、低位电压定标的混合型DAC，减少了无源元件的使用，降低了匹配精度的要求，从而提高了数模转换的精度。

The hybrid calibration DAC reduces the use of passive components and the matching requirements of precision , thus improving the accuracy of digital-analog conversion .

无源元件的高频非理想特性使无源EMI滤波器高频特性变差，而无源元件同样影响有源EMI滤波器的高频特性。

Non-ideal high-frequency characteristics of passive components make high-frequency characteristics of passive EMI filter bad . The passive components also affect the high-frequency characteristics of the active EMI filters .

随着电子信息系统向多功能、小型化、低成本方向快速发展，人们对系统级封装（SystemonPackage，SoP）中各类高性能小型化微波无源元件的需求越来越强烈。

With the rapid development of electronic information systems to multifunction , miniaturization , and low cost etc. , there are more and more urgent demands on high performance miniaturized microwave passive components for system on package ( SoP ) technology .

所提供的电路结构简单，中心频率ω0和品质因数Q可独立调节，所有的电容均接地，滤波器的特性参数对无源元件的灵敏度低，不需任何匹配元件，易于集成。

The proposed circuit is possessed of simple structure , separately adjustable central frequency ω _0 and the quality factor Q , all grounded capacitors , low pass sensitivities , having no matching conditions and more convenient integration .

LLC谐振变流器谐振回路中的无源元件包括：串联谐振电感、谐振电容、并联电感和变压器。

There are altogether four passive components in the resonant tank : the series resonant inductor , the resonant capacitor , the parallel inductor and the transformer .

单片微波集成电路（MMIC）是将有源元件和无源元件都集成在同一个半导体衬底上的微波电路；

A monolithic microwave integrated circuit ( MMIC ) is a microwave circuit in which the active and passive components are fabricated on the same semiconductor substrate .

本文提出了实现一阶电流滤波器的新电路，该电路使用了一个第二代电流传送器（CCⅡ）和最少量的无源元件，实现了一阶低通、高通和全通电流滤波器。

His paper deals with the new first-order current-mode filters which use single sec-ond-generation current-conveyor ( CC ⅱ) and minimum passive components . These circuits can be used to realize first-order low-pass , high-pass and all-pass current filters .

因而，寻找适应SoP中高集成度和兼容性要求，又具有低插损、高功率容量等优点的新型微波无源元件集成技术变得很有必要。

Thus , it is necessary to develop new integration techniques for microwave passives in SoP with high performance , high integration density , good compatibility , low loss and high power handling capability .

将无源元件及IC等全部埋入基板内部的三维封装，不仅能提高电子设备的整体性能，有利于轻薄短小化，而且由于钎焊连接部位减少，可提高可靠性并能有效降低封装的总价格。

3D PKG that all passives and IC are embedded inside of the substrate can not only enhance holistic performance of electronic equipment but aslo promote it lighter and smaller . Furthermore , it can enhance reliability and reduce total prices of package effectively because of less interconnections .

概述了埋入无源元件陶瓷基板，集成无源元件（IPD）硅基板，埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。

This paper is describes the technology trend of passive component embedded ceramic substrate , integrated passive device ( IPD ) Si substrate , passive Component embedded or passive and active component embedded resin substrate .

埋置无源元件的市场需求不断增加，本文介绍了一种生产高阻值埋置电阻材料的方法燃烧化学蒸汽沉积法（CCVD）。

The embedded passive components are occupying an increasing proportion of market . This article introduces a manufacture process of high ohmic value embedded resistor material by Combustion Chemical Vapor Deposition ( CCVD ) .

用陶瓷厚膜埋入无源元件进行设计：填补两大空白

Designing with Ceramic Thick-film Embedded Passives : Bridging the Gaps

高密度封装进展之五&采用无源元件和有源元件埋入技术实现的模块内系统封装

System in Module Using Passive and Active Components Embedding Technology

薄膜或厚膜电路，仅由无源元件组成

Circuit , thin or thick film , consisting solely of passive elements

介绍了一种利用第二代电流传送器构成通用的电流型有源滤波网络的新型结构，这种网络只需对其无源元件稍加修改便可获得各种所需的二阶有源滤波器。

This paper presents a new universal active filter network .

采用接地无源元件，便于集成；

Using grounded passive components makes integration easier ;

介绍埋置式无源元件及技术的优点、发展、应用和今后的研究课题。

The advantages , developments and applications of embedded passive components and technology are introduced .

激光修整埋入无源元件的最佳设计

Optimal Designs for Embedded Passives Laser Trim

采用喷墨技术制造埋入无源元件

Fabrication of Passive Elements Using Ink-jet Technology

通过建立各无源元件的高频模型，提取出其寄生参数。

The parasitic parameters of the passive devices are extracted by establishing each high-frequency model .

这些无源元件是构成无源滤波器的基本元件。

These passive components can be used as basic building elements to make a passive filter .