电镀液

电镀液中Cr（Ⅵ）含量的方波伏安法测定

Determination of Cr (ⅵ) Ion in Electroplating Solution by Square Wave Voltammetry

镀锌钢板的X射线荧光光谱分析&从电镀液到产品，电镀板整个生产工艺的管理可以使用X射线荧光光谱分析进行

Fluorescent X-ray analysis of Galvanized sheet

纳米ZrO2在Ni基电镀液中悬浮稳定性的研究

A Study on Stability of Nano-ZrO_2 in Ni-based Electroplating bath

所得合金晶粒尺寸为6.2~12.7nm，并随电流密度、温度和电镀液的pH值的改变而变化；

The crystal grain size is from 6.2 to 12.7 nm and changes with current density , temperature and the pH value of the electrolyte .

探讨了氯化物体系ZnFe合金电镀液中各组分及其他工艺参数对镀层中铁含量的影响。

The influences of the components in Zn Fe alloy electroplating liquid and other technology parameters on the iron content in the electroplating layer were studied .

碱性锌酸盐电镀液中（pH>13）锌离子主要是以四配位体Zn（OH）2-4的形式存在；

Zinc ions mainly exist in the form of Zn ( OH ) ~ ( 2 - ) _4 in the alkaline zincate bath ( pH > 13 ) .

电镀液的配方、pH值、镀前处理、尖端效应等对镀层的表面质量和镀层与芯轴之间的结合力有重要的影响。

The dependence of the quality of Au cone on the parameters such as composition , pH of electroplating bath , the current density and tip effect , has been discussed in detail .

cn下载的。Sn-Ag合金无氰电镀液

Sn-Ag Alloy Non - CN Electroplating Bath

Ni-W-P合金电镀液中钨的测定

Determination of Tungsten in Ni-W-P Alloy Electroplating Solution

Sn-Ag合金系电镀液和电镀工艺

Sn - Ag Alloy Series Electroplating Solution and Electroplating Process

Sn-Ag合金无氰电镀液

Sn-Ag Alloy Non-CN Electroplating Bath

该方法快速，准确，适用于Ni-W-P合金电镀液中钨含量的测定。

The method was rapid and accurate , and can be used to determine the tungsten content in the alloy electroplating solution . 2 .

Sn-Ni合金电镀液中Ni~（2+）的络合状态研究

A Study on the Complex State of Ni ~ ( 2 + ) in the Electroplating Bath of Sn - Ni Alloy

CVS是目前半导体以及电路板业界最受广泛采用，监控电镀液中有机添加剂的技术。

CVS is a patented technique by ECI company , currently is widely used in semiconductor and PCB industry , to monitor the concentration of organic additives and their breakdown products in plating bath .

纳米Al2O3微粒的加入，阻碍了电极和电镀液界面上的反应活性点，增加了电化学反应的阴极极化。

The reaction active sites at the electrode and electrolyte interfaces will be impeded with the addition of nano-Al2O3 particles in plating solution . Consequently , the adsorption of particles on cathode causes an increase of cathode polarization of electrochemistry reaction .

电镀液组成的变化显著地影响到细线图形的半导体和PCB，因而提出了工艺控制技术的高要求，监控PCB制造中电镀添加剂的老标准将会满足这些高要求的新的生命力。

Both Semiconductors and PWBs have fine features affected by changes in the composition of the plating Solution , thereby creating a high demand for process control techniques . An old standard for monitoring plating additives in PWB manufacturing might find new life meeting these demands .

钨酸钠对其测定值有影响，通过分光光度分析给予扣除，可以满足Ni-W-P合金电镀液中测定柠檬酸含量的精确度要求。

Sodium tungstate has some impact on determination the content of citric acid and the impact can be deducted by spectrophotometric analysis in order to accurately measure the content of citric acid in Ni-W-P alloy plating solution .

叙述了由Sn2+化合物、Ag+化合物、螯合剂和添加剂等组成的Sn-Ag合金系电镀液，该镀液具有优良的稳定性，适用于电子部件的可焊性表面精饰。

The Sn - Ag alloy series electroplating solution containing Sn2 + compound , Ag + compound , chelating agent and additive etc. is discussed . The electroplating solution has excellent stability and is suitable for solderability surface finish of electronic parts .

研究了Zn-P合金电镀液组成及工艺条件对镀层含磷量的影响，在最佳工艺参数条件下，可得到磷的质量分数为0.1%左右的Zn-P合金镀层。

Influence of electroplating solution ingredients and technological condition on phosphorus content of Zn-P al-loy deposits was studied , and the properties of electroplating solution and coat were studied too . Under the opti-mum condition , the Zn-P alloy electroplating coat with P content about 1 % was obtained .

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

糖精电极测定镍电镀液中糖精含量

Determination of saccharin in nickel-plating solution with a saccharin ion-selective electrode

铑电镀液中铑含量不同测定方法的比较

Comparison of the Methods to Determine Rhodium Content in Plating Solution

钨电镀液和电镀层中钨的分光光度法测定

A Spectrophotometric Determination of Tungsten in Electroplating Solution and Electroplated Layer

硫酸锌电镀液中微量铅离子的测定

Determination of Trace Lead Ion in Electroplated Solution of Zinc Sulfate

镍钴电镀液中钴含量容量分析法的改进

Improving of quantitative analysis about Co content in Ni-Co electroplating solution

铜锡合金电镀液中铜、锡含量的测定

Continuous determination of copper and tin content in Cu-Sn alloy electroplating bath

电镀液用水的分析、比较及选取

Analysis 、 Comparison and Selection of Water for Electroplating Solution

测定电镀液中铜、锡的新方法

The new method of continuously determinating copper and stannum in electroplating solution

铅-锡合金电镀液中铅、锡的连续测定

Continuous Determination of Lead and Tin in Electroplating Solution of Lead-tin Alloy

氯化物三价铬电镀液中六价铬离子的去除方法及效果

Elimination of Cr (ⅵ) in Trivalent Chromium Chloride Electroplating Bath