钎料

采用背散射电子相观察钎料与Ni润湿后的界面组织。

The interface structure of the brazing filler metal with Ni after its spreading was observed by backscattered electron images .

选用活性钎料AgCuTi或CuTi对陶瓷与不锈钢进行直接钎接。

Active brazing filler metal Ag Cu Ti and Cu Ti were chosen to braze directly cerment and stainless steel .

还测定了四元CuNiSnP非晶态钎料的熔点、润湿性、钎焊接头机械强度、电阻以及显微组织随P含量的变化关系，发现随着P含量增加润湿性增加。

Wettability , mechanical and electrical properties , and microstructure on the phosphorus content were determined .

铝基活性钎料真空钎焊Cf/C复合材料焊接接头的组织及性能

Microstructure and Properties of Vacuum Brazing C_f / C Composites Using Reactive Al Based Filler Metals

Sn-Zn-Bi-（P，Nd）无铅钎料的微观组织及性能

Microstructure and properties of Sn-Zn-Bi - ( P , Nd ) lead-free solders

增强颗粒Cu对锡铅基复合钎料铺展性能的影响

Effect of enhanced particles Cu on spreading performance of Sn-Pb base solder

钎料中Cu含量为1.0wt%时，焊点的剪切强度最大。

The shear strength is highest when Cu content is 1.0wt % .

含Al2O3活性钎料与Al2O395陶瓷的润湿研究

Wetting Research between Al_2O_395 Ceramic and Active Brazing Alloy Containing Al_2O_3

但随着Ni元素含量的增加，其钎料的熔点也有所提高。

Melting point of brazing flux increased with Ni content .

微合金化是一种有效提高锡基无铅钎料性能的有效途径。本文主要研究和分析在Sn-0.7Cu钎料中添加微量的Co、Ni元素后对其性能的影响。

The micro-alloying is an effective method to improve the properties of Sn-based lead-free solder .

用急冷Al基活性钎料钎焊Si3N4陶瓷的研究

Brazing of si_3n_4 ceramic using rapidly solidified Al-based active filler metals

铝基钎料在SiC及SiCp/6061复合材料上的润湿性研究

Wettability of Aluminum Base Filler Metals on SiC and SiC_P / 6061 Composites

TiN改性钎料连接Si3N4陶瓷的接头高温性能

Solid-liquid state bonding of Si_3N_4 ceramics and its joint high-temperature properties

SnCu钎料镀层与Cu/Ni镀层钎焊接头的界面反应

Interfacial reactions between Sn-Cu solder alloy and Cu / Ni coatings during reflow soldering

Al2O3陶瓷/Ni-Ti钎料反应界面形成的微观机理

Microscopic Mechanism of Formation of Reaction

Ni基钎料激光钎焊金刚石磨粒界面显微结构及形成机理

Delaminating Behavior and Formation Mechanism of the Interfacial Microstructure in the Laser Brazing Diamond with Ni-Cr Alloys

微量添加元素Bi、In、Ag在Sn－Pb钎料中的表面活性作用

Surface-active action of microadding elements Bi , in and Ag in tin-lead alloy solder

Si3N4－钢铁钎接用银－铜－钛钎料及其钎接工艺

Ag-cu-ti braze alloy used for si_3n_4-steel jointing and joint process

含Ti钎料钎焊碳纤维复合材料与钛合金的界面微观分析

Brazed Interface Microanalysis of Carbon-fiber Reinforced Composite Material and Titanium Alloy by Brazing Filler Metal Containing Ti Element

快冷与普通Al-Si钎料中Si的扩散行为研究

Study of diffusion behavior of element Si in rapid solidifiable and common Al-Si brazing metal

稀土元素Ce对锡银铜无铅钎料润湿性及钎缝力学性能的影响

Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead free solder

Cr对Ni-P系钎料钎焊不锈钢接头性能的影响

Effect of Cr on Property of Stainless Steel Joint Brazed with Series Ni-P Filler Metal

活性元素Ti在CBN与钎料结合界面的特征

Characteristics of Active Element Ti at the Interface of CBN and Filler Alloy

活性钎料真空钎焊Si3N4/钢接头性能的研究

Properties of Vacuum Brazed si_3n_4 / steel joint using active brazing filler metal

Cu元素对铝/铜钎焊用Zn-Al钎料性能的影响

Influence of Cu on Properties of Zn-Al Solders for Al / Cu Brazing

在钎料合金中加入稀土元素Ce，对无铅钎料的铺展面积有所改善。

Adding rare earth element Ce into solder alloy can improve the wettability of lead free solder .

Sn-Zn钎料Cu接头的界面反应及力学性能

Interfacial reaction and joint strength of Sn-Zn solder / Cu

Ag对Sn-Pb电子钎料合金性能的影响

Effect of Ag on the Material Properties of Sn-Pb Solder Alloys

TIG电弧钎焊钎料液滴内部流场数值模拟及分析

Numerical Simulation and Analysis of Flow Field in Arc Brazed Filler Metal Droplet

采用复合钎料钎焊Si3N4陶瓷

Si_3N_4 ceramics brazing with composite soldering materials