锡珠
- 网络Solder Ball;Solder beading
锡珠-
回流焊中常见的缺陷&锡珠无铅PCB组件再流焊焊接工艺的热变形仿真分析
The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process
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锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠
Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation
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仅对在电容、电感旁边锡珠的形成及对电路产生的影响进行分析，并提出了解决办法。
Analyze of the impact of solder pearl beside capacitors and inductors on circuits put forword the solution .