陶瓷基板

直接敷铜Al2O3陶瓷基板的界面产物研究

Interfacial Product of Direct Copper - Bonded Alumina Substrate

YAG调Q激光陶瓷基板划片机

Ceramic Substrate Nd : YAG Q-Switching Laser Cutter

臭氧发生器用Al2O3陶瓷基板材料的改性研究

Study on the al_2o_3 ceramic plate material modifier for ozonizer

分析了YAG调Q激光陶瓷基板划片的机理。

The mechanism of cutting ceramic substrate by using Nd : YAG Q-switching laser was analyzed .

Sol-gel法制备低温共烧多层陶瓷基板用高硅玻璃

Sol-gel Method Fabricate Glass of High Content of Silica for Low-temperature Co-fired Multilayer Substrate

水基流延法制备（Sr，Ca）TiO3陶瓷基板的研究

Study on the aqueous tape casting for ( sr , ca ) tio_3 ceramic substrate

BC陶瓷基板附着力的研究

Research for Adhesion of Ceramic Substrates by Direct Copper Bonding

AlN陶瓷基板在空气中的热氧化行为探讨

Survey on initial oxidation behavior of AlN ceramic substrate in air

AlN陶瓷基板材料热导率与烧结助剂的研究进展

Research Progress in Thermal Conductivity and Sintering Additives of AlN Packaging Material

功率电子器件用AlN陶瓷基板的研制

Aluminium Nitride Ceramic Substrates for Power Device

流延法制备AlN陶瓷基板的研究

Tape Casting Process of Aluminium Nitride Substrate

适用于VLSI封装的用Ag-Pd布线的低介电常数多层玻璃&陶瓷基板

Low Dielectric Constant Multilayer Glass-Ceramic Substrate with Ag-Pd Wiring for VLSI Package

本课题利用钌系厚膜热敏电阻浆料，在96%wt的Al2O3的陶瓷基板上成功地制作出热敏电阻器。

In this thesis , thick film thermosensor is firstly fabricated on 96 % wt Al2O3 ceramic substrate successfully by laser micro-cladding thick film paste of the thermosensor .

在玻璃陶瓷基板材料中加入PS有机球能有效地降低基板的介电常数，但同时影响基板的抗折强度。

The addition of PS can reduce the dielectric constant of glass-ceramic substrate materials effectively , but reduce the flexural strength at the same time .

通过对比实验，得出采用96%的氧化铝陶瓷基板的自激式射频电源适用于激光管与射频电源一体化的射频CO2激光器的结论。

Through the contrast experiment , the conclusion is obtained that the self-excited RF power source is suitable for the RF-excited CO2 laser whose laser tube and RF power is integrated .

整个器件结构为陶瓷基板／内电极／厚膜绝缘层／发光层/薄膜绝缘层／ITO透明电极。

The whole structure of the device is ceramic substrate / internal electrodes / thick dielectric film / light-emitting layer / thin dielectric film / ITO .

这种A／D转换器在36.5mm×10.5mm的双层薄膜布线陶瓷基板上组装了18个IC裸芯片和其他片式器件及电阻网络，并封装于32引出端双列直插式陶瓷管壳中。

The MCM of A / D converter consists of 18 IC chips , some surface mount devices and resistor networks on 36.5 mm × 10.5 mm ceramic substrate with double layer routing .

结果表明：敷接过程中Cu[O]共晶液体对未经氧化处理的AlN陶瓷基板的浸润性较差，不能形成牢固的结合；

The results suggested that bonding could not be achieved without surface oxidation because of the no wetting of Cu [ O ] eutectic liquid .

结果表明，ZnO和PbO能够提高玻璃对陶瓷基板的润湿性能，进而增强镍电极的附着强度；

The results show that ZnO and PbO can enhance the wetting properties of the glass on the ceramic substrate , and therefore produce higher adhesion of Ni electrodes .

Si芯片贴装于陶瓷基板可以很好的取代它，既可以提高组装密度，焊点寿命也比前者提高了6倍。陶瓷封装对陶瓷基板搭配是其中可靠性最好的，它的焊点寿命最长。

Sticking the Si chip to the ceramic base plate can replace the former , because it not only raise the density of assembling , but also life-span of solder joints is prolonged to 6 times than the former ;

采用压电陶瓷基板与1-3型压电复合材料串联连接，沿表面两相互垂直的方向切割PZT陶瓷，在切槽间浇注环氧树脂，制备出新型的1-3-2型压电复合材料。

A novel 1-3-2 piezoelectric composite was developed , which was composed of piezoelectric ceramic plate and 1-3 piezoelectric composite in structure . It was fabricated by dicing PZT ceramic along mutually perpendicular directions on the flat surface and then filling epoxy into grooves .

概述了埋入无源元件陶瓷基板，集成无源元件（IPD）硅基板，埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。

This paper is describes the technology trend of passive component embedded ceramic substrate , integrated passive device ( IPD ) Si substrate , passive Component embedded or passive and active component embedded resin substrate .

本文采用SrAl2O4：Eu~（2+），Dy~（3+）发光材料与所研制的低温软化透明釉料以适当的比例混合，烧结在陶瓷基板上而制成一种新型光致发光材料。

This paper prepares a novel photoluminescence material by sintering the mixture of SrAl2O4 : Eu2 ~ , Dy3 ~ phosphor and low softening temperature transparent glass frits by appropriate proportion onto ceramic surface .

采用CuO浆料为布线导体材料是制造多层陶瓷基板的新技术，该方法可彻底除去浆料中的有机物，制造性能良好，易于推广和批量生产的多层陶瓷基板。

A new method for producing the multi-layer ceramic substrate is to use CuO slurry as interconnection conductive material . This method can remove the organism thoroughly from the slurry to make the multi-layer ceramic substrate with good performances , easy popularization and batch production .

本文的研究对象是低烧结温度、低介电常数的玻璃材料（代号LDK），用作LTCC玻璃陶瓷基板的主料。玻璃的制取采用高温熔融法。

Low sintering temperature and low dielectric constant glass material ( designed as LDK ) is the objective of this paper , which used as the main compostion of LTCC glass-ceramic substrates and fabricated by high-temperature melting .

玻璃陶瓷基板上铜薄膜的化学气相沉积

Thin copper films prepared by chemical vapor deposition on glass-ceramic substrates

实用化28层陶瓷基板的设计与制作

Design and fabrication of a ceramic circuit board with 28 layers

最后对陶瓷基板进行了制作和测试。

At last , the ceramic substrate is product and test .

氧化铝陶瓷基板过孔的新型激光打孔工艺

New Laser Drilling Technique for Making Via Holes on Alumina Substrates

低温共烧多层陶瓷基板烧结收缩控制技术

Shrinkage Control Technologies for Low Temperature Co-fired Multilayer Ceramic Substrate