液晶玻璃基板

随着半导体相关产业的发展，半导体晶圆及液晶玻璃基板（TFT-LCD）等产品呈现大型化、薄型化的发展趋势，其传输过程中需要采用无摩擦非接触的方式以确保表面无划伤。

With the development of semiconductor related industry , TFT-LCD products are now showing the trends of becoming larger and thinner , and therefore non-contact mode is required during the conveying process in order to prevent scratch on the surface .

雷射热裂切割法具有加工速度快、切割面平整及热残留应力低等优点，近年来已逐渐取代传统钻石刀切割研磨法成为光电产业液晶玻璃基板加工主流。

The thermal fracture cutting technology for brittle materials has become the crucial technology for LCD glass substrate cutting to meet the low residual thermal stresses requirement .

在有限元软件Ansys环境下，建立了三维液晶显示玻璃基板激光切割热应力场的有限元分析模型。

The three-dimensional finite element analytic model of thermal stress field in laser cutting of LCD substrate is established by using the Ansys software .

液晶显示玻璃基板激光切割热应力场的有限元仿真

Finite element simulation of thermal stress field in cutting LCD glass substrate by laser