制程

负责制程巡检，确保所有人员及设备均按要求作业。

In charge of the IPQC inspection and make sure all the operators and equipment running under control and requirement .

计算机与PLC组成的DCS在PCB制程中的应用

Application of DCS Which Constituted by Computer and PLC in Manufacture Process of PCB

采用3D激光扫瞄焊膏检测设备协助在实际生产中快速的检测并收集制程中的落锡厚度、面积及体积等相关数据。

Using 3-D laser scanning detection equipment Solder collect data about drop-tin thickness , area and volume .

后者将ARRAY制程的的产出与彩色滤光片组合，涉及较多人工作业。

The manufacturing process of the latter is to combine the output of ARRAY and color filters , which involves more manual work .

熟悉项目管理，ISO体系要求，制程质量管理知识者优先考虑；

Knowledge in Project management , ISO system , process quality management will be a plus .

适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。

Suitable for medium multilayer printed circuit board , computer , communication equipment , OA equipment , lead-free PCB process etc.

冲压制程包装设计并持续改善，评估和制作包装规范（POP）。

The press system range packing design continues the improvement , and assesses and makes the Procedure of packaging ( POP ) .

Intel与镁光目前正在努力试图重新在NAND闪存制程争夺战中占据领先地位。

Intel and Micron are also seeking to regain the lead in the NAND process technology race .

封装制程中超音波焊线楔形接合，是将IC晶片与外部电路连接的一种互相连系技术，并能提供电能输入和讯号沟通的功能。

Ultrasonic wedge bonding is one of the most important interconnection techniques for IC dies inner circuits with the outer world for the power and signal transportation .

COG制程中的紫外光清洗工艺研究

Research in the Ultraviolet Rays Cleaning of COG Process

至于AMD方面，我们认为大部分于32nm制程芯片产品有关的问题已经得以解决。

As it relates to AMD , we believe that the majority of the32-nm issues have already been addressed .

会使用温测电路的原因为CMOS制程并没有其他制程的天线耦合辐射热计所需要的特殊材料。

We use the thermal sensing circuit to replace the special material in antenna coupled bolometer in other process which the CMOS process does not provide .

基于供应链管理的某ODM电子厂制程外包研究及应用

Research and Application of Supply Chain Management Based on a Process ODM Outsourcing Electronics Factory

BGA组装制程能力分析

Analyse BGA Assembly Process Capability

PTH制程的稳定性控制

Control of PTH Process

在某一BCD制程生产过程中，要求在比较高的温度条件下生长厚铝。

The thick aluminum film is grown under high temperature in the BCD manufacturing process .

CIGS薄膜太阳能电池之单靶溅镀制程及应用

Production process and application of in-line sputter for CIGS thin film solar cells

并利用氮化矽钝化层制程对元件进行钝化（passivation）制程，以改善在氮化镓系统所一直被诟病的表面状态以及高频操作时的电流崩溃现象；

The additional passivation layer using the silicon nitride material on device surface reduces the surface trap effect and improve the current collapse drawback .

硅片超精密磨床是半导体集成电路（IC）制造中的关键装备，主要应用于IC制程中的硅片制备加工和IC后道制程中图形硅片的背面减薄。

Ultra-precision grinding machine is one of the key equipments in integrated circuit manufacturing , which is mainly used in both manufacture of primary wafer and backside thinning of patterned wafer .

声音晶片的全部制程，是完全相容于互补式金属氧化物半导体（cmos）的工业标准制程。

The entire process of building a sound chip is fully compatible with the standard industry process for semiconductor manufacturing , called complementary metal oxide semiconductor , or CMOS .

新工厂将继续在300mm晶圆上利用65nm制程生产Cell处理器等。

The new company will continue producing semiconductors on a300 mm wafer line and use a65nm production process .

在TFT-LCD切割裂片制程中，研究了刀轮角度、切割压力、切入量等工艺条件的优化对后段cell制程和module制程的影响。

In the process of TFT-LCD manufacturing , effects of optimized scribing and breaking parameters , such as scribe-wheel angle , cut pressure and press amount on the cell process and module process are studied .

面向TFT-LCD制程的Mura缺陷机器视觉检测方法研究

Study on the Methods of Machine Vision Inspection for the Mura Defect of TFT-LCD Process

InSb焦平面探测器背面钝化的研究元件制程：蚀刻，表面钝化，介电材料薄膜。

Study of Backside Passivation in InSb Focal Plane Detector Device Processing : Etching . Surface passivation ; dielectric films .

一般来说，功率管器件的欧姆接触触点以及栅极是采用金材料制作，但是在基于GaN的HEMT中如果仍采用金材料制作这些结构则必须采用特殊的CMOS制程工艺。

Conventionally , gold is used for ohmic contacts and gate structures in power devices , but it makes GaN processing incompatible with conventional CMOS processing .

作为DCS供应商，中控聚焦于制程工业，包括化学与石化、电力、石油与天然气、金属与采矿、炼油、制药以及食品与饮料。

As a DCS supplier , SUPCON is focused on process industries , including Chemical Petrochemicals , Electric Power , Oil Gas , Metals Mining , Refining , Pharmaceutical , and Food Beverage .

三星近日宣布将开始量产两款30nm制程NAND闪存芯片产品。

Samsung tonight said it has started mass production of two variants of its30 nanometer NAND flash memory .

三星还表示目前已可向外提供28nmLPH制程的芯片样品。

Process shuttles for the.28-nm LPH process are available now , Samsung said .

有趣的是AMD的制程发展规律也与摩尔定律相契合，他们总是会在Intel推出新制程技术的同年晚些时候推出自己的新制程技术。

AMD has also stayed on track with Moore 's law for the past tech nodes , introducing new processes during the same year but usually later than Intel .

此文件的目的，是提供一个基于PCBA制造复杂性的对PCBA制程能力的评估方法。

It is intended to provide an assessment of PCBA Manufacturing Capability based on PCBA Manufacturing Complexity .