厚膜电路

Al2O3质厚膜电路基片的抗热震机理

The mechanism of thermal shock resistance of al_2o_3 ceramic thick film substrate of circuit

应用厚膜电路技术，将电路所用器件装在-10mm×15mm的氧化铝基片上。

The thick-film technology was applied to assemble the module circuit devices on a 10mm × 15mm alumina substrate .

用厚膜电路实现阵列触觉信号的采样

Sampling of Tactile Sensing Array Signal Using a Thick-Film Circuit

本文引入了一种厚膜电路制造的新技术&激光微熔覆技术。

A new technology which called laser micro cladding technology was presented .

无源厚膜电路构成的静态型电流和电压继电器

The solid-state current and voltage relays with passive solid-state circuit

薄膜或厚膜电路，仅由无源元件组成

Circuit , thin or thick film , consisting solely of passive elements

基于不锈钢基板的厚膜电路制备技术

Technology for Thick Film ICs on Stainless Steel Substrates

接收机全部由厚膜电路集成模块组成。

The receiver consists of modules which are fabricated in thick film circuits .

电泳复合精铸制壳工艺图形法-厚膜电路工艺用

Technology of investing shell mold by electrophoresis graphic-art technique

复合陶瓷钢厚膜电路发热片的生产工艺和发热机理

Manufacturing Technology and Heating Principle of the Compound Ceramic Thick Film Circuit Heater Inductor

该仪器主要单元采用厚膜电路，稳定性、一致性好；

Being adopted ASIC processes in the key circuit , the tool is stable and well in consistency .

图形法-厚膜电路工艺用GB/T17473.3-1998厚膜微电子技术用贵金属浆料测试方法方阻测定

Graphic-art technique Test methods of precious metal pastes used for thick film microelectronics & Determination of sheet resistance

论述了无需直流辅助电源、用厚膜电路构成的静态型电流和电压继电器。

The static current and voltage relays made of solid state circuit and without DC auxiliary supply are presented .

它将温湿度敏感元件和处理电路采用仿厚膜电路工艺做成固体化结构。

It had the firm structure of thick mask circuit which consists of temperature & humidity sensor and processing circuit .

在叙述点火模块厚膜电路的生产过程中系统介绍了厚膜封装工艺、相关设备、技术参数和检测方法。

This pa-per introduces thick film assembling technique , equipment , technical parameters and testing methods while narrating the manufacturing process of thick film circuits .

电能计量模块采用电度表专用厚膜电路HDB6进行电能计量，简化了电路设计，同时还利用继电器控制连接或断开用户的供电回路；

Measuring module measures electric energy by using power meter 's special circuit which simplifies circuit design and connects or breaks up power supply circuit by relay ;

详细分析了以ASCII码存储的ProtelPCB版图文件的存储格式和图元数据结构，并基于Protel版图文件接口，实现了应用于厚膜集成电路制造的激光微细熔覆柔性布线CAD/CAM系统开发。

The file store format and element data structure in Protel PCB FILE 6 are described in this paper , and its potential application in designing and manufacturing thick film integrated circuit board based on laser micro cladding technique is given .

厚膜混合电路声表面波振荡器

Thick Film Hybrid Circuit Surface Acoustic Wave ( SAW ) Oscillators

壁厚型3例；厚膜集成电路

Thickened wall 3 cases ; The Thick Film Integrated Circuit

厚膜集成电路网印应注意的技术问题

Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits

行星夹具膜厚均匀性计算厚膜集成电路

Film uniformity calculation of large caliber coating machine the thick film integrated circuit

浅谈厚膜集成电路基板印刷的质量控制

A Brief Talk on Quality Control of Thick Film Integrated Circuit Substrate Printing

自关断器件厚膜保护电路的研制

Development of Thick-film Protecting Circuits for Self-turn-off Devices

GB/T14619-1993厚膜集成电路用氧化铝陶瓷基片

Alumina ceramic substrates for thick film integrated circuits

集成电路有厚膜集成电路和薄膜集成电路。

The integrated circuit contain thick film integrated circuit and the thin film integrated circuits .

但早期的工作的主要目标是设计与制作双极型高温器件和厚膜集成电路。

The early work took aim to design and manufacture high-temperature bipolar devices and thick film ICs .

文本介绍厚膜混合电路声表面波振荡器的原理、设计、制作和实验结果。

The operation , design , fabrication and experimental results of surface acoustic wave ( SAW ) oscillators implementing thick film hybrid circuits are presented in the paper .

由于半桥式电路比全桥式电路少用两只功率开关管和驱动厚膜集成电路，在几千瓦到十几千瓦的输出功率范围内已越来越多地得到采用。

Half-bridge circuit economizes two power switches and two thick-film drive integrated circuits compared with full-bridge circuit , so the application of half-bridge circuit is increasing when the output power range is from kilowatts to tens kilowatts .

MCM在厚膜混合集成电路中的应用

The Application of MCM in Thick Film Hybrid Integrated Circuit

结合厚膜混合集成电路的测试要求。着重介绍了基于PCI总线的卡式仪器及基于GPIB接口控制的程控仪器。

Aimed at the test requirements of hybrid Ices , the paper also focuses on the description of PCI bus module Instruments , and GPIB program-controlled instruments .