合接

hé jiē
  • close grafting
合接合接
  1. 由澳洲坚果高接换种试验研究表明:7种嫁接方法中合接和改良切接的嫁接成活率最高达38.9%;

    Experiment on top grafting of Macadamia integrifolia showed that the survival rate could reach the highest ( 38.9 % ) with splice grafting and joint grafting of 7 grafting methods .

  2. 为防止在变电站中带电合接地刀闸、挂接地线与带电接地刀闸、接地线合闸送电2类误操作事故,研制了一种变电站接地状态电子管理显示系统。

    An electronic management display system of grounding status in substation is studied , which is to prevent two kinds of mal-operation of closing grounding-switch and articulating earth-line , sending the electricity by taking electricity with grounding switch and closing earth line .

  3. 微硅加速度计中静电键合封接技术的应用

    Application of Anodic Bonding to Micro - Si Accelerometer

  4. 耐张类拉线线夹型式优锲式铝合压接两种形式。

    Strain guy wire clamp has two types which are wedge type and compression joint .

  5. 弓部向外延伸有一第一端与一第二端,分别扣合在一接地轨道上。

    The bow part is extended outward to form a first end and a second end which are buckled on a grounding rail respectively .

  6. 现有技术的一种太阳篷收合结构的枢接组件结构复杂。

    The pivot component of a sun hood folding structure in the prior art is complex in structure .

  7. 在微硅加速度计的研制中,静电键合具有传统胶接技术所无法比拟的优点,是目前该加速度计研制中广泛应用的粘接技术。

    In the development of micro-Si accelerometer , anodic bonding has an advantage that traditional gluing technique can ′ t match , so it is now widely used in adhesion of the accelerometer .

  8. 介绍了微机械系统制造工艺技术,体微机械、表面微机械加工技术、键合技术(封接技术)及LIG-A技术,并对这些技术的应用进行阐述。

    Manufacturing technologies for MEMS , including material removal and surface treatment technologies for MEMS , bonding technology ( sealing-in technology ) and LIGA technology are described in this paper . Besides , a brief exposition of their applications are given .