封装材料

  • 网络Encapsulant;packaging materials
封装材料封装材料
  1. 超高速GaAs集成电路封装材料、工艺和结构的研究

    Research on Packaging Materials , Processes and Structures for Ultrahigh-Speed GaAs ICs

  2. 热阻是热量管理的关键参数,正确的热量管理方法是通过选择合适的封装材料和封装结构,使LED器件的封装热阻最小。

    The correct thermal management makes the package thermal resistance of the LED the smallest by choosing the suitable packaging materials and packaging structure .

  3. X射线对双层封装材料剂量增强效应的影响

    Effect on Dose Enhancement of Double Deck Package Materials Produced by X-ray

  4. 白光LED封装材料对其光衰影响的实验研究

    Experimental Research on Influence of Packing Materials of White LED on Its Luminous Decay

  5. 随着大功率白光LED发展的日新月异,对LED封装材料的要求亦越来越高。

    With the fast development of high power white LEDs , people need better LED packaging material .

  6. 随着LED功率及亮度的提高,人们对LED封装材料亦是提出了更高的要求。

    With the improvement of LED power and brightness , we put forward more requirements towards LED encapsulation material .

  7. MEMS封装材料数据库系统的设计与实现

    Design and Implementation of Packaging Material Database System in MEMS

  8. MEMS器件的封装材料与封装工艺

    Package Materials and Processes of MEMS Devices

  9. 一种新型电子封装材料70%SiAl合金通过喷射沉积技术被开发出来。

    A novel electronic packaging material , silicon-aluminium alloy ( 70 % Si-Al ) has been developed using spray deposition technique .

  10. 退火工艺对轧制复合CPC电子封装材料性能的影响

    Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material

  11. 随着LED亮度和功率的不断提高,大功率LED对封装材料的耐老化、折射率和透过率等性能亦提出了更高的要求。

    With the improvement of the LED brightness and power , high-power LED has higher requirements for ageing-resistant performance , refractive index and transmittance .

  12. Sn基无铅封装材料研究

    A Study on Sn-Based Lead-Free Packaging Materials

  13. PPS高性能电子封装材料的研制

    Study on High Performance Poly ( Phenylene Sulfide ) Materials for Electronic Encapsulation

  14. 实验采用高压绝缘性能优良的Al2O3作为锰铜敏感元件的封装材料,首次实现了敏感元件清洁的无机固态封装,从根本上消除了高压旁路电阻效应。

    Consequently , the manganin sensing elements were ' cleanly ' encapsulated in inorganic solid matrix and the high-pressure shunt effect was eliminated radically .

  15. LED的主要组件有芯片、金属线、支架、导电胶、封装材料,其中封装材料用来密封和保护芯片正常工作。

    LED device made up with chips , wires , brackets , conductive adhesives and packaging materials . The function of the packaging materials is to protect the chips .

  16. 界面SiO2层对SiC/Al电子封装材料热膨胀系数的影响

    Influence of Interface on the Coefficient of Thermal Expansion of SiC / Al Electronic Packaging Composite

  17. 本研究综述了MEMS的封装材料,包括陶瓷、塑料、金属材料和金属基复合材料等。

    Account of package materials of MEMS , including ceramics , plastic , metal material and metal compound material , etc was given .

  18. 等离子喷涂W-Cu电子封装材料的组织与性能

    Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

  19. 退火工艺为900℃/1.5h时,CPC电子封装材料的综合性能最好。

    The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours .

  20. 目前大功率LED应用于通用照明上还存在着一些问题有待解决,比如新型的封装材料,过高的封装热阻和合适的测试方法等。

    Otherwise some key issues should be solved before high power LEDs widely application in general illumination market , such as new package materials , package heat management and suitable measurement method .

  21. 论文分为以下四个部分:(1).综述了LED的发展现状及国内外封装材料的研究进展。

    This paper can be divided into four parts . ( 1 ) . The progress and present situation of LED and also present the future development of encapsulate materials were briefly reviewed .

  22. 压制压力对Si-Al电子封装材料性能的影响

    Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

  23. 固晶材料是最重要的LED器件封装材料之一,其热物理性能参数和几何尺寸对封装的总热阻具有较大的影响。

    Die-attach material is the most important one of all the LED packaging materials , its thermal physical properties and geometric dimensions have a great effect on the total thermal resistance of the package .

  24. 热压法制备Si-Al电子封装材料及其性能

    Properties of Si-Al Electronic Packaging Materials Fabricated by Hot Pressing

  25. PBGA中环氧模塑封装材料的热力学应力分析

    The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA

  26. 对粗化后的环氧树脂封装材料表面进行了SEM形貌分析、表面粗糙度及表征亲水性的接触角的计算。

    Thus the morphology of the epoxy resin packaging material after coarsening pretreatment was observed using a scanning electron microscope , while its surface roughness and water contact angle were measured .

  27. 加入高折光率MQ树脂进行协调补强,可获得机械性能良好、韧性也较好的LED封装材料。

    Therefore , high refractive MQ resin was added as reinforcement agent , and silicone materials with good mechanical properties , good toughness and high transmittance were obtained for LED packaging .

  28. 经过细化的粉石英、硅微粉、白炭黑等微米甚至纳米级SiO2更是在橡胶补强、紫外屏蔽、电子封装材料等化工领域应用广泛。

    Refined , quartz and silica powders , white carbon and nano-SiO2 have been widely used for rubber reinforcement , UV shielding and electronic packaging materials .

  29. Si-Al电子封装材料粉末冶金制备工艺研究

    PM Process of Si-Al Electronic Packaging Materials

  30. 氮化铝(AlN)陶瓷是最理想的高导热基板和封装材料,可广泛应用于高功率器件、电路和组件。

    Aluminum Nitride is an ideal substrate and packaging material applied in high power devices , circuits and modules due to high thermal conductivity .