灌封胶

γ-射线辐照对蓖麻油基聚氨酯灌封胶性能的影响

Effects of γ - ray Irradiation on Properties of Castor Oil-polyurethane Potting Materials

新型环氧灌封胶的研究

Study on epoxy potting sealant

选用聚合物H和改性异氰酸酯K为主要原料合成聚氨酯灌封胶。

Polyurethane ( PU ) pouring sealant was synthesized with polymer H and modified isocyanate K as basic materials .

模态分析表明：随着封装管壳内灌封胶弹性模量（E）的提高，封装结构同一振型的模态频率也提高；

Results of the modal analysis showed that tre natural frequency of the same mode increased with the elastic modulus ( E ) of the potting resin .

结果表明：EP灌封胶的热导率随着导热填料用量的增加而增大；

The results showed that the thermal conductivity of EP encapsulating adhesive was increased with increasing thermal conductive fillers contents .

动态载荷下等效应力分析表明：芯片粘结胶、芯片及其硅盖板之间封接胶环的等效应力随着灌封胶弹性模量（E）的增加而减小；

Stress analysis under dynamic load showed that the equivalent stress in both the die attachment adhesive and the sealing ring adhesive between the chip and the silicon protective cap decreased with the increase in the elastic modulus of potting resin .

MDI-50在电器灌封胶中的应用研究

Application of MDI - 50 in Encapsulants for Electronics

结果表明，当采用醇类LAP-101为扩链剂、醇类XSJ-02为活性稀释剂，并且扩链剂和活性稀释剂的比例为1∶5左右时灌封胶的力学性能最好。

The results show that the mechanical properties are the best when using the LAP-101 as the chain extender , XSJ-02 as the diluent and the ratio of them is1 ∶ 5 .

一步法制备聚氨酯通信电缆灌封胶

Polyurethane pouring sealant for communication cable prepared by one step synthesis

固化剂对酚醛树脂灌封胶性能的影响

The Effect of Curing Agent on Properties of the Encapsulation Adhesive

环氧树脂灌封胶的性能预测及配方优化

Prediction of Properties and Optimization of Formula for Epoxy Pouring Sealant

电子控制器灌封胶特性与应用工艺

Characteristic Technology and Application of Sealing Glue for Electronic Controller

太阳能电池灌封胶性能的研究

Study on property of solar cell epoxy resin pouring sealant

环氧树脂电器灌封胶的阻燃化研究

Study on the flame-retardation of the epoxy resin pouring sealant for electrical device

电器灌封胶的合成反应是本体反应，制备工艺非常简单。

Synthesis of encapsulants for electronics is simple , its reaction is noumenal .

一种电子工业用新型灌封胶的研究

Study on the new type of perfusion and seal gum for the electronic industry

电子工业用加成型硅橡胶型灌封胶的研究进展

Application of addition-type silicone encapsulants in electronic industry

环氧树脂灌封胶在电子电器工业领域应用广泛。

The epoxy resin sealant has extensive application in the electronic and electrical equipment industry .

高压聚焦电位器环氧灌封胶

Epoxy pouring sealant for high-voltage focusing potentiometer

研究了空气湿度对双组分聚氨酯灌封胶固化过程内部产生气泡的影响。

The effect of air - humidity on bubble of the cured two-component polyurethane was studied .

封装结构的模态频率随着灌封胶弹性模量的增大而增大。

The modal frequency of the packaging structure increases with the elastic modulus of potting material .

对封装管壳内灌封胶弹性模量影响进行了系统分析。

The influence of elastic modulus of the potting resin in the package was systemically studied .

蓖麻油基聚氨酯灌封胶的固化行为研究（Ⅱ）固化过程中异氰酸根含量变化和热量变化

Studies on Curing Behavior of Castor Oil-based Polyurethane (ⅱ) & NCO Content and Heat Changes during Curing

考察了扩链剂种类、活性稀释剂及异氰酸酯对聚氨酯灌封胶力学性能的影响。

The effect of kinds of chain extender , active diluents and the structure of isocyanate on mechanical properties of the elastomer is discussed .

硅橡胶型灌封胶主要由基础聚合物、交联剂、催化剂、填料等组成，灌封胶的性能与胶料的组成、结构有关。

Silicone encapsulants consist of rubber compound , cross-linking agent , catalyst and filler , their performance is related to materials and compositional structure .

在通常灌封胶弹性模量下（E>1GPa），封装结构的模态频率主要取决于管壳的模态频率。

For the common potting resin ( E > 1 GPa ), the natural frequency of the package structure was mainly dominated by the header .

当弹性模量E<1GPa时，灌封胶对振动很敏感，封装结构表现为灌封胶的振动；

When E < 1 GPa , the potting resin was sensitive to motion and the packaging structure behaved as the vibration of the potting resin .

结果表明，该灌封胶具有很好的流动性、较好的耐热性和粘接性能，可以满足细小缝隙的灌封。

As a result , the epoxy sealant has excellent liquidity , good heat resistance and adhesive ability , it can be applied in pouring of small cracks .

导热灌封胶，硅胶，电子用硅胶，极高的导热性和绝缘性，优秀的高温运用范围，UL94V-0认证，能满足电子机械和航天、航空工业的需要。

Extremely highly thermal conductivity and dielectric strength , excellent for high temperature , has a UL Flame Rating of94V-0 , useful in electric , mechanical and airborne , aerospace industry .

介绍一步法制备通信电缆灌封胶的方法，其影响因素及制品的性能，并且与国内外同类产品性能进行了对比。

In this paper , preparation of polyurethane ( PU ) pouring sealant for communication cable by one step synthesis , some effect factors and properties were described and compared with that of the same products made in China and abroad .