电子芯片

微槽群蒸发器在电子芯片冷却方面的应用

Application of micro capillary groove evaporator to electronic chip cooling

微流体技术在电子芯片冷却中的应用研究进展

Application prospects of microfluidics technology in electronic chip cooling research

SWOT量化模型在消费电子芯片设计公司战略规划中的应用研究

Applied Research of a SWOT Quantitative Model in the Stratagem Programming of Consumer Electronic Products IC Design House

并且这种散热装置不仅仅适用于CPU的散热，对其他电子芯片也同样适用，具有较广泛的应用前景，易于推广。

This system is not only applied to CPU chip but also other electronic chips . So it has a wider application prospects , and can be popularized easily .

借助于快速傅立叶变换电子芯片和成熟的数字信号处理技术，光OFDM系统显示出强大的色度色散容限和偏振模色散容限。

Aided by electronic fast Fourier transform circuit and sophisticated digital signal processing technologies , optical OFDM exhibits advanced tolerances both of chromatic dispersion and polarization mode dispersion ( PMD ) .

接着，针对高端消费类电子芯片和通信类电子芯片的性能要求，围绕基准参考源的温度系数和电源抑制比等性能指标，设计了四种低电压低功耗高性能的亚阈值MOSFET基准电路。

Then , four low power sub-threshold MOSFET voltage reference circuits meeting the development of the senior consuming electronic chips and the communication electronic chips have been designed . While they mainly emphasize on the temperature coefficient and PSRR performance .

第三章详细描述了一个适用于消费电子芯片设计公司的SWOT量化模型，这个模型针对芯片设计公司做了适当的扩充，使因素的量化方式上和因素选取上更能贴近实用。

In chapter III , we elaborate SWOT quantization model with is applied to CE IC design house . This model has been enriched according to the house . Then it will be much more suitable for practical use . By the way quantization and selection methods .

以最新微电子设备冷却剂FC－72为工质，实验研究了自由和浸没情况下，圆形射流冲击5mm×5mm模拟电子芯片的局部对流换热情况。

This study investigates local characteristics of heat transfer from a simulated microelectronic chip to an impinging circular jet , using dielectric liquid ( FC-72 ) as working fluid . The jet diameter studied is 0.987 mm , and the simulated microelectronic chip size is 5 min × 5mm .

电子芯片冷却用微管道散热器的换热性能分析

Analysis of Heat Transfer Performance about Microchannel Heat Sinks for Electronic Equipment Cooling

华夫板在电子芯片厂房施工中的研究与应用

Study on Waffle Slab in the Construction of Electric Chip Plant and Its Application

电子芯片散热器特性的测试研究

An experimental study of the performance and the characteristics of heat sinks of electronic chips

京晶：那估计所有的商品都必须贴上特殊的电子芯片。

I guess the merchandise would all have to be tagged with special electronic chips .

本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。

Embodiments of the disclosure include use as a wafer level underfill , and an encapsulant for electronic chips .

在电子芯片厂房中，洁净室是其关键部位与核心区域。

In the electric industry , clean room becomes the base area in the construction of the electric COMS chip manufactory .

监控器也被安置在睡觉的人身下的床单里&人们认为它的电子芯片可能会干扰睡眠。

Monitors are also built into the sheet under the sleeper - the idea being that electrical cords would disturb sleep .

目前电子芯片对散热的要求越来越高，烧结式吸液芯微热管已经成为电子芯片理想的散热元件。

With the increasing demand for the cooling of electronic chips , the micro heat pipe with the sintered wick has become an ideal heat radiator .

微尺度通道在高功率电子芯片的冷却、强放热反应的取热、航空航天领域都有重要的应用潜力。

Mini - microchannels have promising prospects in applications such as the cooling of high-power electronic chips , heat removal of intensively exothermal reactions , and aeronautical engineering .

受到哺乳动物消化系统和血液循环系统中物质运输与分配网络所具有的分形特征启发，文中设计、加工出了一种电子芯片冷却用的硅制分形微管道网络散热器。

Inspired by the fractal pattern of mammalian digestive and circulatory system , a magical design of fractal branching channel heat sinks for cooling of electronic chips is studied .

对以水为换热介质的微通道冷却器对模拟发热电子芯片进行冷却的换热性能进行了实验研究。

The experimental investigation on the thermal performance of microchannel heat sinks for cooling the integrated electronic chip with the high power density using the liquid-cooling technology was conducted .

随着电子芯片的小型化发展，超细焊丝领域的这一差距，将严重地影响整个中国电子工业小型化发展的趋势。

Along with the miniaturization development of electronic chip , this gap of the ultra fine field of welding wire , will affect seriously the tendency that entire Chinese electronic industrial miniaturization develops .

微型热声制冷机具有结构简单、可靠性高、无污染、便于与电子芯片封装等优点，在微电子热量管理中倍受关注。

A miniature thermoacoustic refrigerator occupies many special advantages such as simplicity , reliability , no pollution , readily adaptable to microcircuit interfacing , which attracts great interest in the use of heat management .

近年来随着微电子技术的高速发展，电子芯片的处理能力和处理速度大幅度提高，为大数据量的实时处理和复杂系统控制提供了硬件平台。

With the technology of micro-electronic developing promptly in recent years , the process ability and speed of electronic appliance and equipment has increased greatly , which provides the hardware platform for the mass data processing and the complex system control .

利用微槽群蒸发型热沉技术设计了一种新颖的用于电子芯片散热的微槽群蒸发器，对影响微槽群蒸发器散热性能的各种因素进行了实验研究。

A novel micro capillary groove evaporator for electronic chip cooling by using the micro capillary groove heat sink technique was designed , and an experimental investigation on the influence of various factors on cooling performance of the evaporator was carried out .

电子标签芯片是无线射频识别（RFID）技术的核心，其模拟电路的设计十分关键。

Transponder IC is the core of Radio Frequency Identification ( RFID ) technique , and its analog circuit design is very important .

论文设计了一种适用于无源UHFRFID电子标签芯片的测试及开发平台，对电子标签芯片进行相关功能性验证。

Paper designed a test and development platform for passive UHF RFID tag chip . Authentication-related functionality can be done .

电子标签芯片包括模拟部分、数字控制部分、EEPROM存储部分等3个部分，并且对数字控制部分的主状态机的状态转换进行了详细的分析。

The tag is consist of analog part , digital control part and embedded EEPROM part .

论文主要研究放在无源UHFRFID电子标签芯片前端模拟电路的设计和EEPROM存储器电路的系统结构改造。

Thesis research on the design of passive UHF RFID tag chip front-end analog circuitry and EEPROM memory circuit system structure transformation .

之后，对无源UHF超高频无线射频识别标签芯片的系统结构进行了设计，对低功耗无源电子标签芯片设计中涉及到的关键技术进行了研究，对设计中的创新点进行了着重的阐述。

Thereafter , the system structure UHF passive UHF RFID tag chip was designed . The paper studied the low-power passive RFID chip design related to the key technical difficulties .

在此基础上，将电子标签芯片的数字基带划分为多个模块，对各模块分别予以RTL级设计，并通过FPGA硬件平台进行了原型验证。

On this basis , we divided the digital baseband of electronic tag chip into several modules , and designed each module separately in the RTL-level , which was prototypically verified by FPGA hardware platform .

基于ISO/IEC18000-6C标准，以设计出符合标准的标签芯片为设计目标，超高频（UHF）无源电子标签芯片模拟电路被提出。

Based on the ISO / IEC18000-6C standard , the analog circuit of the Ultra High Frequency ( UHF ) passive transponder IC is designed , according to the design requirements of analog circuit .