芯片制造

电迁移问题和集成超低k电介质材料与Cu镀层的新抛光方法是芯片制造中的一个关键问题。

A key problem in chip fabrication is that the new polish method for electromigration and ultra-low K dielectric and Cu electroplating level .

中国已批准美国半导体公司英特尔（Intel）在中国东北城市大连兴建一家总投资额25亿美元的高级芯片制造厂。

China has approved plans by Intel , the US semiconductor company , to build a $ 2.5bn advanced chip fabrication plant in the north-eastern city of Dalian .

可以通过该系统输入各类制造工艺信息，对芯片制造信息进行综合查询，并对LED芯片制造过程进行知识挖掘。

Operator can input manufacture process , query and knowledge discovery .

H公司是一家业内领先的芯片制造企业，其主要产品为微处理器。

H is a leading chip manufacturer , whose main product is microprocessor .

动态随机存储器IC芯片制造技术的进展与展望

Advance and future prospect for fabricating technology of DRAM IC chips

二探针扩展电阻分布法在IC芯片制造中的应用

Application of Two-Probe Spreading Resistance Technique in the Manufacturing Process of IC

高质量的硅晶片是芯片制造和IC发展的基础；

The high quality silicon wafer is the basic of chip manufacturing and IC development .

数字信号处理（Digitalsignalprocessing）技术，从20世纪60年代以来，随着计算机科学和信息科学、集成芯片制造工艺的飞速发展，数字处理技术应运而生并得以快速发展。

The technology of digital signal processing has made great progress with the development of information science and chip technology since it was born in 1960 ' s.

这个开发组织主要面对新的市场项目如LED和太阳能光伏产品等，成立这个新部门的原因主要是台积电传统的芯片制造业务增长较为缓慢。

The group will focus on new growth markets , such as LED and solar , as its traditional foundry business is slowing .

芯片制造企业英特尔（Intel）；医药用品经销商Owens&Minor；

chipmaker Intel , Owens & Minor , a medical-supplies distributor ;

市场的激烈竞争使得MCU芯片制造厂家们对于生产成本的控制十分严格。

The intense competition in market makes it more rigorous for cost control of MCU producers .

在IC芯片制造过程中，将排布在硅晶圆上的集成电路切割分离是其中一个重要的工序，目前用于切割分离集成电路的刀具主要是金刚石超薄切割片。

In process of fabricating integrated circuit , a key technique is to separate the integrated circuits on the silicon wafers .

近年来，随着集成电路（IC）芯片制造工艺的发展和电路结构的更新，对运算放大器提出了更高的要求。

In recent years , with the development of integrated IC chip manufacturing process and update of the circuit structure , higher demand was proposed for the operational amplifier .

本文主要研究知识挖掘方法在高亮度LED（LightEmittingdiode，发光二极管）芯片制造过程中的具体应用。

In this paper , the most research work focused on the application of knowledge discovery method in the manufacture process of HB-LED ( High Brightness Light Emitting Diode ) chip .

300mm晶圆芯片制造技术的发展趋势

Developmental trend for processing technology of 300 mm wafer chip manufacturing

将近10年前，中芯国际从IBM获得了45纳米芯片制造技术许可，但该技术在当时已现老态。

Nearly a decade ago , SMIC was granted a licence to IBM 's 45 nanometre chipmaking technology - already , at the time , a technology that was getting long in the tooth .

然而，目前许多与大功率LED芯片制造相关的关键技术问题尚未完全解决，使得对大功率LED芯片的优化设计以及制造工艺中材料选择、工艺参数控制等缺乏实验数据的支撑。

Some key technical problems relating to high power LED chip manufacturing have not been fully solved , which lead to the lack of experimental data support for optimized design of LED chip , material selection and fabrication process control .

另外，正如我们之前所报道的那样，尽管IBM芯片制造技术联盟的成员在32/28nm节点主推基于Gatefirst工艺的HKMG技术，但是到20nm节点，联盟的成员将集体转向Intel主导的gatelast技术。

After pushing the gate-first high-k approach for the32-and28-nm nodes , IBM 's technology partners will move to rival gate-last technology at the20-nm node .

芯片制造上，一方面，为了降低生产成本，逐步增大硅片的尺寸；另一方面，为了提高IC的集成度，不断减小刻线宽度。

On the chip manufacturing side , on the one hand , the wafer size increases in order to reduce the production cost ; on the other hand , the line width decreases to improve the integration of the circuit .

清华紫光（TsinghuaUnigroup）是中国在芯片制造领域境外收购最雄心勃勃的集团。昨天，该集团的一个部门表示，将放弃去年9月达成的一宗交易，按照协议该集团原本会收购约15%的股份。

Yesterday a unit of Tsinghua Unigroup , China 's most ambitious overseas acquirer in the chipmaking sector , said it would abandon a deal agreed last September that would have seen it acquire a stake of about 15 per cent .

英特尔（Intel）正将芯片制造过程中劳动力最密集的环节&半导体测试和封装业务，集中到四川成都进行，以节省成本。此举意味着该芯片制造商上海工厂的2000个职位将不保。

Intel is consolidating its semiconductor testing and packaging operations , the most labour-intensive part of chip production , in Chengdu in the province of Sichuan to cut costs , a move that will erase 2,000 jobs at the chipmaker 's Shanghai plant .

介绍了聚酰亚胺（PI）作为硅双极型大功率开关器件芯片制造阶段表面钝化膜的工艺技术，该钝化工艺的工艺简单、成本低且能与普通的硅平面制造工艺兼容。

Author introduces a process technology that the Polyimide ( PI ) is used as the surface passivating of the Si bipolar high-power devices about chip madding phase . The process has the advantages of simple process , costing cheaply and being compatible with the common flat madding process .

随着工艺技术的发展，65nm工艺技术已逐渐成为主流的芯片制造工艺。

With the fast development of technology , 65 nm CMOS process technology has gradually become the mainstream in parallel with the frequency elevation .

曾经是技术领域中市值最高的芯片制造公司英特尔（intel）第一次被竞争对手高通公司（qualcomm）超越，体现了智能手机和个人电脑行业中的“风云变幻”。

Intel , the chipmaker that was once a stock market champion for the technology sector , has been overtaken for the first time in market value by rival qualcommin a sign of the rapidly changing fortunes of the smartphone and personal computer industries .

我们是世界著名电脑芯片制造龙头企业。

Our company is world famous leading manufacture of computer chips .

芯片制造的电化学处理技术

Electrochemical Processing Technologies in Chip Fabrication : Challenges and Opportunities Manufacturing

中国大陆是芯片制造业一支日益强大的力量。

The mainland is a growing force in chip manufacturing .

集成电路芯片制造线的投资问题

Review on Investment Problems of IC Chips Manufacturing Line

台湾经济部还在考虑为处境艰难的芯片制造企业纾困。

The economic ministry is also considering a bail-out for ailing memory-chip makers .

在集成电路芯片制造过程中，一个重要的工序是金属薄膜淀积。

Metal film deposition is an important step in the IC manufacturing process .