导电胶

从无铅组装的角度出发，详细分析了无铅组装技术涉及的无铅焊料和导电胶组装技术，阐述了传统的锡铅焊接与无铅焊接的工艺差异，提出了该技术要推广应用所面临的技术难点。

Lead-free solder and conducting resin packaging technology involved in lead-free packaging are analyzed . The technological differences between the traditional tin-lead welding and lead-free welding are also described . Finally , some technical difficulties in promoting lead-free packaging technology are presented .

在Ag导电胶上化学镀铜工艺

Electroless Copper Plating Process on the Silver Paste Film

测得了导电胶的渗滤阈值并用扫描电镜（SEM）观察胶粘剂导电通道形成的过程。

The percolation threshold was determined and the conducting pathway of the electric conductive adhesive was observed by SEM .

SiO2纳米粒子对铜导电胶连接强度的影响

Effect of sio_2 nano-particles on adhesion strength of copper conductive adhesives

LED的主要组件有芯片、金属线、支架、导电胶、封装材料，其中封装材料用来密封和保护芯片正常工作。

LED device made up with chips , wires , brackets , conductive adhesives and packaging materials . The function of the packaging materials is to protect the chips .

以导电胶涂层作为辅助电极、石墨作为工具电极，用实验的方法考察了电火花加工非导电陶瓷SiO2的可行性；

This paper discusses the feasibility of electrical discharge machining insulated ceramics SiO2 by the way of assisting electrode .

在固化温度为145℃，固化时间为2h时，导电胶连接强度达到20MPa。

The adhesion strength reached 20 MPa when the adhesives cured at 145 ℃ for 2 h.

本文详细分析了目前常用的各种点胶技术及其优缺点，阐述了各种胶水的粘接原理，选择了时间/压力型点胶技术和各向异性导电胶应用于RFID生产中。

This paper has analyzed the most usual dispensing technology and their merits and faults , expounded the bonding principles of different adhesive , and chosen a Time / Pressure model and ACA to be used in RFID manufacture .

为适应高密度超细线路连接的需要，研究了紫外光固化各向异性导电胶。得到了可以用UV（紫外光）有效固化的各向异性导电胶（ACA）。

A UV-curable anisotropically conductive adhesives ( ACA ) has been developed for connecting excitation circuit and LCD , or electro-luminescence display , so as to satisfy the requirement of high density and ultra-fine pitch connecting .

研究了添加剂对银导电胶进行性能的影响：偶联剂（KH-550）的添加改善了导电胶的粘结强度；

Lastly , the performance of Ag filled conductive adhesive was optimized through adding additives . KH-550 could improve the Viscosity of Ag filled conductive adhesive .

在此基础上，借助银浆导电胶，制成了中间充有PI与不同纳米SiC含量的SiC／PI树脂基复合材料薄膜的平行板式电容器。

On this basis , draw support from the conductive glue of silver thick liquid , fill on the condenser of parallel modes in Chinese operatic music of SiC / PI resin base composite membrane with PI and different nanometer SiC content while making .

CLD-20结构型导电胶的研制及应用

Development and Application of CLD-20 Structural Electric Conductive Adhesive

随着微电子封装技术的发展及绿色电子工业的兴起，各向异性导电胶膜（ACF）作为一种新兴的绿色封装互连材料，日益受到电子工业和研究者的广泛关注。

With the development of microelectronic packaging technology and the rise of green electronic industry , anisotropic conductive adhesive film ( ACF ) has attracted more and more attention as a new kind of green packaging interconnect materials .

据这些消息人士称，供应异方性导电胶膜（ACF）、氧化铟锡（ITO）等材料的日本公司库存足可坚持至5月份，但可能到不了6月份。

According to these sources , the Japanese companies that supply such parts as anisotropic conductive films ( ACF ) and indium tin oxide ( ITO ) materials & have enough inventory to last until May , but may not be able to sustain supplies until June .

一种铜粉导电胶，由E51环氧树脂、密胺-脲醛树脂MF，铜粉及少量添加剂组成，固化温度为100℃，体积电阻率≤3.6×10-3Ω·cm，该导电胶可应用在电子工业中。

The electroconductive adhesive is composed of epoxy resin ( E51 )、 copper powder and a small amount additive , Its curing temperature is at 100 ℃, Its resistivity is ≤ 3.6 × 10-3 Ω· cm . The adhesive can be applied for electron industry .

如今，这两个系统使用“湿”电极，它通过头骨下导电胶收集脑波，但该公司正在研究采用干法工作电极的新版本，Bruckner说。

Today , both systems use " wet " electrodes , which pick up the brainwaves using a conducting gel under the skullcap , but the company is working on a new version using dry electrodes , said Bruckner .

Ag-CuO材料热稳定性及耐热循环能力较好，但与电池其它组件间的热匹配性较差。其次，文中对银导电胶封接材料进行了研究。

Ag-CuO material had the better thermostability and the thermal cycling ability , but had the worse thermal match performance to the other components of the cell . Secondly , the silver electric adhesive sealing material was studied , and the optimal sealing technics were determined .

倒装芯片各向异性导电胶互连的剪切结合强度

Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film

适用于各向异性导电胶和导电膜的导电微粒的制备与研究

Preparing and Research on Conductive Particles Applied in Anisotropic Conductive Film

各向异性导电胶用新型导电复合粒子的制备

Preparation of a novel conductive composite particle for anisotropic conductive adhesive

254&21常温快固铜粉导电胶的研究

Study on the Room Temperature Fast-curing powered Copper Conductive Adhesive 254-21

微电子封装用各向异性导电胶膜的研究进展

The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging

各向异性导电胶膜黏弹性力学行为的实验研究

Experimental Study on Viscoelastic Mechanical Behaviors for Anisotropic Conductive Adhesive Film

各向同性铜粉导电胶的制备及性能研究

Study on Preparation and Properties of Isotropic Copper Filled Conductive Adhesive

导电胶的可靠性与胶层内应力研究

On Reliability of Electrically Conductive Adhesives and Inner Stress in Adhesive Layer

用于体表电极导电胶的研制

A Study of the Conductive Glue for Body Surface Electrode

混合微电路用导电胶粘接特性的研究

Research on Bonding Properties of Electrically Conductive Adhesives for Hybrid Microcircuits Application

利用热分析对导电胶进行组分分析的研究

Study on the Compositions of Conductive Paste by Thermal Analysis

紫外光固化导电胶的老化性能研究

Study on ageing property of conductive adhesives with UV curing

国外微电子封装用导电胶力学性能研究进展

Oversea progress in mechanical properties of electrically conductive adhesives for microelectronic packages